Elephantech Inc.
Mr. Nobuhiko Okamoto, Global Marketing, Elephantech Inc.
Nobuhiko Okamoto is Global Marketing at Elephantech Inc., leading global business development and strategic partnerships for advanced semiconductor packaging technologies. Previously, he held business leadership roles at Panasonic and Socionext, where he established the company's sales network in Taiwan. With over 30 years of international experience, including assignments in the U.S., Italy, and Mexico, he specializes in connecting deep-tech innovation with global markets and strategic partnerships.
Topic:
Nanotechnology for Next-Generation Semiconductor Packaging and AI Infrastructure
Abstract:
The rapid growth of AI, high-performance computing, and heterogeneous integration is driving demand for advanced metallization technologies that enable finer wiring, higher interconnect density, deeper vias, and larger package substrates while reducing manufacturing complexity and cost.
Elephantech is a Japan-based deep-tech company developing proprietary copper nanotechnology based on its 15-nm-class Self-Assembling Copper Nanoparticles (SA-CuNP). Its technology portfolio consists of two solution platforms: Nano Copper Deposition (DeepVia™ and DS-SAP™) and SAphire™ (SAphire™ G and SAphire™ B).
Nano Copper Deposition complements conventional PVD and plating processes by selectively depositing copper where conventional metallization struggles to achieve sufficient coverage. It enables reliable high-aspect-ratio via metallization for HDI PCBs and advanced IC substrates, supporting finer wiring, improved process reliability, and simplified substrate architectures.
SAphire™ is a low-temperature copper nanopaste platform designed for next-generation semiconductor packaging, including Through-Glass Via (TGV) filling and copper-sintered interconnections for ultra-high-layer-count substrates. Compared with conventional approaches, it offers lower material cost, simplified processing, high reliability, and improved manufacturing scalability.
Elephantech is collaborating with semiconductor manufacturers, substrate suppliers, PCB companies, equipment makers, and research partners to accelerate commercialization. This presentation introduces the company's nanotechnology platforms and demonstrates how they can enable the next generation of AI infrastructure and advanced semiconductor packaging while creating new opportunities for technical collaboration and strategic partnerships.
Key Technologies Covered:
- 15-nm-class Self-Assembling Copper Nanoparticle (SA-CuNP) technology
- Nano Copper Deposition for selective copper metallization
- DeepVia™ for high-aspect-ratio via metallization in HDI substrates
- DS-SAP™ dual-seed architecture for advanced IC substrates and fine-line interconnects
- SAphire™ G for void-free Through-Glass Via (TGV) filling
- SAphire™ B low-temperature copper sintering for substrate-to-substrate interconnection
- Low-temperature copper sintering for advanced semiconductor packaging
- Glass-core substrate and advanced package substrate technologies
- Manufacturing process simplification, cost reduction, and reliability enhancement
- AI, HPC, and next-generation semiconductor packaging applications