余國寵博士

Dr. KC Yee is currently a R&D Director of Advanced Packaging Technology at TSMC. He holds a Ph.D. in Mechanical Engineering from the University of Texas at Austin. Dr. Yee has over 25 years of semiconductor experience in advanced packaging, covering optical MEMS, optoelectronics, advanced flip chip, wireless connectivity module, 2.5D/3D IC and wafer level fan-out. He is currently a member of SEMI Taiwan PKG & TEST Committee, a member of SiPhIA committee, and a NTHU Industry-appointed professor at CoSR. Dr. Yee received the Outstanding Engineer Award from the Chinese Institute of Engineers in 2007 and owned/ co-owned 100+ granted US patents.