HPC/AI Device Testing: Bridging Gaps with Integrated Solutions

With the rapid development of AI, the need for semiconductor testing has grown in importance. The continuous narrowing of foundry technology nodes and the emergence of advanced packaging (PKG) solutions present challenges for semiconductor testing. The challenges include optimizing probing interfaces, managing increased power density, and accommodating high-pin count designs. In this presentation, the content will focus on integrated solutions designed to overcome these testing challenges, with a particular emphasis on innovative thermal management strategies.

Key Technologies Covered

• Semiconductor testing

• AI/HPC devices

• Thermal management