From Hidden Defects to Reliable Systems: Dose-Aware X-ray Inspection and Metrology for Advanced Packaging in the AI Age
AI and HPC applications are accelerating the transition toward larger, denser, and more valuable advanced packages, including emerging glass panel substrate technologies. As package complexity increases, reliability risks often originate from buried defects in interconnects, redistribution layers, vias, interfaces, and substrate features that are difficult to access with optical inspection or electrical pass/fail testing alone.
This presentation discusses how X-ray inspection and metrology can contribute to a broader inspection portfolio for advanced packaging and glass panel manufacturing. While optical, electrical, acoustic, and other methods provide complementary information, X-ray adds non-destructive visibility into hidden structures and enables quantitative analysis of defect size, position, geometry, and process variation. Combined with AI-based defect recognition, X-ray can support earlier reliability screening and faster root-cause understanding. At the same time, dose-aware inspection strategies are essential to protect sensitive semiconductor devices while generating reliable physical data.
Key Technologies Covered
- Non-destructive X-ray inspection for advanced packaging
- 3D X-ray metrology of hidden interconnects
- Glass panel substrate inspection
- Dose-aware inspection strategies for sensitive semiconductor devices
- AI/ADR-based defect detection, segmentation and classification
- Reliability screening and physical root-cause analysis
- At-line inspection, selective sampling and process feedback workflows
