Advancing Test to Enable Advanced Packaging Roadmaps

Advanced packaging is redefining system integration, enabling larger, more complex devices through chiplet architectures, 2.5D/3D stacking, and heterogeneous integration. As device sizes expand and functional density increases, the industry is facing unprecedented challenges in power delivery, thermal management, yield loss, and test cost. These factors are no longer secondary considerations—they are primary constraints shaping the feasibility, scalability, and economic viability of next-generation designs.

This presentation examines how test must advance to enable the advanced packaging roadmap in the context of increasing power density, severe thermal gradients, and growing package footprints. Large multi-die systems introduce new challenges in test access, signal integrity, and coverage, while high power levels and localized hotspots directly impact device behavior, timing, and measurement accuracy during test. At the same time, yield learning becomes more complex across multiple die and interfaces, and test cost scales rapidly with device size, test time, and system-level validation requirements.

We will explore strategies for power-aware and thermal-aware test, along with approaches to improve yield and manage cost in large heterogeneous systems. Topics include new test insertions, thermal management, instrumentation scaling and device interfacing. The importance of developing a test strategy —balancing test coverage, throughput, and cost—will be emphasized as a key enabler of manufacturing success.

As advanced packaging continues to push the limits of size, power, thermal complexity, and integration, innovation in test becomes critical to achieving high yield, controlling cost, and ensuring reliable system performance across the entire product lifecycle.

Key Technologies Covered

• Advanced packaging
• Test strategy
• Test thermal management
• New test insertions