Limits to Growth: Solving Supply Chain Limitations in The AI Data Center Era

上午 9:50 - 上午 10:15

AI data center needs are driving advanced packaging developments for GPUs/ASIC based accelerators, CPUs, and XPUs.  Growth of the high-performance packages in the AI data center are described.  Shortages of assembly capacity, interposers, build-up substrates, and materials have the potential to limit growth.  Availability of HBM is also critical.  This presentation describes the supply chain limits and discusses possible solutions.  Trends in package architectures and materials are described.

 

Key Technologies Covered

  • HPC packages for data centers and growth
  • Shortages of assembly and materials

Featured Speakers

Ms. Jan Vardaman

Ms. Jan Vardaman

President, TechSearch International, Inc.

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987.  She is the author of numerous publications on emerging trends in semiconductor packaging and assembly.  She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer and received the Distinguished Achievement Certificate for Technical Leadership and Expertise in May 2024. She received the President’s Award in 2026 from the Global Electronics Association (GEA) for her contributions to the electronics industry.   She received the IMAPS GBC Partnership award in 2012, the Daniel C. Hughes, Jr. Memorial Award in 2018, the Sidney J. Stein International Award in 2019, and she is an IMAPS Fellow.  She served on the IEEE CPMT Board of Governors for two terms.  Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.  She received her M.A. from University of Texas, in 1981.