AI-Native EDA: Designing the Chips That Power the Future

下午 3:55 - 下午 4:20

AI is a five-layer architecture spanning energy, chips, infrastructure, models and applications, and Siemens spans these layers across more than 30 industries. But powering intelligence at scale demands one thing above all else: chips. And chips depend on EDA.

Semiconductor design today faces a perfect storm of challenges: designs of unprecedented complexity rooted in advanced packaging, heterogeneous integration and hardware-software convergence; a talent crisis with the industry on track to need over one million additional skilled workers globally by 2030; and surging demand fueled by AI infrastructure build-out. This is the frontier of AI-native EDA and the focus of this presentation.

Siemens' response is a clear, three-pillar AI strategy built around speed, productivity and confidence. Faster engines harness GPU acceleration, in-tool machine learning and reinforcement learning to dramatically reduce simulation and verification runtimes across the full design cycle, delivering speed improvements of up to 1000x. Smarter execution deploys purpose-built agentic AI that autonomously orchestrates multi-tool workflows from high-level synthesis through physical verification and board design, delivering productivity gains of 10 to 50x. Trusted outcomes continuously validate every agent decision against our physics-based EDA engines, creating self-verifying AI workflows that increase confidence through trusted engineering outcomes.

EDA designs the chips that power AI. Without it, the entire stack stalls. This presentation explores how AI-native EDA, built on faster engines, smarter execution and trusted outcomes, makes sure it never does.

Key Technologies Covered

AI-native EDA and what that means for the future of electronic design
GPU acceleration of EDA tools
In-tool machine learning / reinforcement learning in EDA tools
Agentic AI and autonomous orchestration of end-to-end EDA workflows
Self-verifying, long-running agentic EDA workflows
Siemens and NVIDIA collaboration for AI-native EDA

Featured Speakers

Mr. Sathish Balasubramanian

Head of Products, Siemens

Sathish Balasubramanian leads the product teams for the Centralized AI and Solido Custom IC divisions at Siemens EDA. An experienced product leader with 20+ years in the EDA industry, his focus is on bringing value to the semiconductor ecosystem through innovative solutions. He is proficient in scaling product portfolio growth and expanding market share and revenue through a relentless focus on data-driven execution and thought leadership.

Prior to Siemens, Sathish held various product management, strategic business development, and corporate development roles at Cadence Design Systems and Synopsys. He received his BS in Electronics & Communication from the University of Madras, his MS in Computer Engineering from the University of Alabama, and his MBA from UC Berkeley's Haas School of Business.