310mm Panel Level Platform for Next Generation Package Solutions

下午 4:30 - 下午 4:55
  • Advanced Fanout packaging. 
  • Panel Level Fanout solutions
  • Wafer vs. Panel process benchmark
  • 310mm Panel Level solutions in FOCoS and FOCoS-Bridge.

 

Key Technologies Covered

  • 310mm Panel Level Fanout
  • FOCoS and FOCoS-Bridge
  • Advanced Fanout Solutions
  • Maskless exposure

Featured Speakers

李德章

李德章

技術處長, 日月光

Teck Lee is the Technical Director of Advanced Fanout solutions in the Corp. R&D organization at ASE.  He joins ASE in 2000 as a Bumping process engineer, later he worked on the Glass based Wafer Level IPD development.  Since 2018, he has been leading the Advanced Fanout on RDL and Silicon Bridge based interposer development, most recently he has extended his work from Wafer to Panel Level Fanout solutions for HPC and AI applications.