Enabling System Integration in FOPLP: High-Precision Sub-Micron Interconnects at Panel Scale

下午 2:40 - 下午 3:05

The growing demands of AI and high-performance computing are driving the adoption of Fan-Out Panel-Level Packaging (FOPLP) to achieve higher integration density and greater manufacturing efficiency. However, the transition to large-format panels introduces significant process control challenges, including panel warpage, shrinking line-and-space dimensions, die placement accuracy, and solder joint quality, all of which directly impact interconnect yield. This presentation examines the precision equipment requirements for enabling system integration in FOPLP, with a focus on high-accuracy pick-and-place and bonding solutions that maintain sub-micron placement stability across panel-scale substrates, supporting reliable high-volume production.

 

Key Technologies Covered

  • Fan-Out Panel-Level Packaging (FOPLP) 
  • High-Accuracy Pick-and-Place Technology 
  • Precision Die Placement and Alignment 
  • Advanced Bonding Technologies 
  • Sub-Micron Placement Accuracy 
  • Panel Warpage Compensation 
  • Fine-Pitch Interconnect Assembly 
  • High-Volume Manufacturing Enablement 
  • Packaging for AI and High-Performance Computing (HPC) applications

Featured Speakers

Jing Jing_ST26

林俊勤博士

Senior Vice President and Chief Counsel for Advanced Packaging (AP), Semiconductor Solutions, ASMPT Limited

Dr. Lim Choon Khoon (CK) is a Senior Vice President and Chief Counsel for Advanced Packaging (AP), Semiconductor Solutions, ASMPT

 

CK works closely with the Semiconductor Solutions leaders on Advanced Packaging (AP), covering areas like strategy, advocacy, trend-scouting, and technology collaborations. With decades of experience in the semiconductor industry, CK has built a strong background across engineering, manufacturing, and leadership roles.

 

CK holds a Bachelor of Science (Honours) in Production Engineering and Production Management degree from the University of Nottingham, United Kingdom. CK was also awarded a Doctor of Professional Practice (DPP) by the European International University in Paris for work in Advanced Packaging for AI. More recently, in recognition of contributions and leadership in Advanced Packaging, CK Lim received an Honorary Doctorate from the International Business School of Scandinavia (Denmark), followed by an Honorary Professorship from the University of Kennedy (France).