Keynote: FOPLP for Advanced Packaging: Promise, Practical Limits, and the Road to Scalable Manufacturing

下午 1:25 - 下午 1:50

Fan‑Out Panel‑Level Packaging (FOPLP) is gaining increasing attention as the semiconductor industry seeks more cost‑effective and scalable approaches for heterogeneous integration. Nevertheless, translating its technical promise into manufacturing reality remains a complex endeavor.

This presentation will Position FOPLP within the advanced‑packaging ecosystem, illustrating how it differs from wafer‑level fan‑out and substrate‑based integration technologies. Identify the application domains that best leverage the unique advantages of FOPLP. Examine the practical challenges that currently limit widespread adoption, including Panel warpage, Redistribution‑layer (RDL) uniformity, Process integration complexities, Reliability qualification requirements, Ecosystem standardization. Through this analysis, attendees will gain a clear understanding of where FOPLP fits on the packaging roadmap and what hurdles must be overcome for it to become a mainstream solution.

 

Key Technologies Covered

  • Multi‑Die Heterogeneous Integration
  • Hybrid RDL Formation 
  • Panel‑Warpage Compensation Techniques 
  • Localized Curing & Low‑Temperature Polyimide (LTPI) RDLs.
  • Emerging Application Domains – AI application for high I/O density and cost advantage.

Featured Speakers

Mr. Jonas Hsu

徐潤忠

Sr. Director, MediaTek Inc.

Jonas Hsu is Senior Director at MediaTek, leading IC Package, Substrate, and PCB technology development for advanced platforms including AI PCs, Flagship mobile, Data Center AI, RF-SiP, and PMIC.

Previously at Apple, he established the substrate team enabling package solutions from A7 through M-series across iPhone, iPad, Mac, Apple Watch, and AirPods. With expertise spanning advanced package architecture, substrate technology, and NPI-to-HVM execution.

Jonas has a strong record of scaling cutting-edge packaging innovations into high-volume production. He holds 19 issued U.S. patents and brings decades of industry-leading experience to the global semiconductor packaging community.