Semiconductor-X – A Secure and Interoperable Data Ecosystem using Digital Twins for Semiconductor Supply Chain Use Cases

下午 3:55 - 下午 4:20

Semiconductor-X, a European project funded by German government, is targeting an interoperable and secure data space for the global semiconductor supply chain to improve resilience and efficiency, and to enable new business models of collaboration. The project partners have developed a set of business relevant demonstrators for semiconductor supply chain use cases ranging from purchase order over fab to equipment vendor data exchange for process optimization to overall supply chain management mitigating sudden supply chain disruptions and resource bottlenecks. The talk will present the data ecosystem concept and share examples of the demonstrators. This includes AI based supply chain modelling and optimization as well as assessment of data quality. The supply chain modelling includes the topics of raw material forecasting, modelling of geopolitical risk scenarios and other supply risks. Using AI also enhances and facilitates the data ecosystem: e.g. mapping of existing data structures into digital twins and AI enhanced cybersecurity. The data ecosystem paves the way to autonomous manufacturing e.g. addressing aspects of optimization in abatement control. These are the low hanging fruits of automated optimization which result in immediate use in industry. This can be expanded to a ‘autonomous’ manufacturing approach even beyond a single fab. An outlook will be given to the next step of applying AI to create new business models.

Key Technologies Covered

Digital Twin technology (AAS)
E2E Security methodology
Open-source software ecosystem (Tractus-X, Eclipse)
AI driven data conversion

Featured Speakers

Dr. Harald Gossner

Senior Principal Engineer, Intel

Harald Gossner holds the position of a Senior Principal Engineer at Intel. He received his diploma degree in physics from Ludwig-Maximilians-University, Munich in 1990 and his PhD in electrical engineering from Universität der Bundeswehr, Munich in 1995. For 15 years he has worked on the development of electrostatic discharge (ESD) protection concepts with Siemens and Infineon Technologies. In 2011 he joined Intel leading the system ESD robustness development for Intel products.

He is the co-founder and co-chair of the Industry Council on ESD Target Levels representing more than 60 companies including all leading semiconductor manufacturers. He is President Emeritus of the EOS/ESD Association, Rome, NY, IEEE Fellow and editor of IEEE Electron Device Letters.

In his role as technology advisor, he is member of the industry advisory boards of the Bavarian Government and of several Fraunhofer institutes. Since 2024 he is leading the project Semiconductor-X, coordinating the development of a dataspace for a resilient supply chain of semiconductors for Europe. He is also responsible for Intel’s activities to build-up a design ecosystem of innovative designs in digital leading edge technologies in Europe.