AI-Driven Insights: Turning Data into Fab Performance

下午 2:05 - 下午 2:30

In semiconductor manufacturing, the focus has long been on optimizing individual tools—yet the next wave of potential lies in how they are connected. As fabs become more complex, with increasing numbers of systems, data sources, and interdependencies, fragmented data still slows decisions, limits transparency, and leaves value untapped.

Siemens sees integrated data, industrial analytics, and digital twins as the inflection point. By converging IT and OT and enabling virtual commissioning, fabs can simulate, validate, and optimize before execution – cutting risk, accelerating ramp, and unlocking performance from day one. To sustain this, we will address data security and integrity in highly connected manufacturing environments, ensuring these integrated networks accelerate fab ramp-up and new product introduction safely.

On foundation, industrial AI sharpens operations – flagging issues early, enabling data-based decisions, and uncovering patterns and insights. However, this technological shift also redefines the human element; we will explore the evolving role and the new skill sets engineers require to thrive in these AI-driven fabs. Ultimately, a strong data backbone enables collaborative feedback loops between manufacturing and design, turning every run into a source of intelligence.

Siemens shows how this convergence is reshaping the rules of the industry – moving from fragmented operations to truly connected, continuously optimized, and secure fabs.

Key Technologies Covered

Industrial AI for Engineering
Predictive maintenance and anomaly detection leveraging AI
AI-driven Yield Optimization
Comprehensive Digital twin
Contextualized Data Integration Layer with IT/OT Integration
Closed-loop Design to Manufacturing feedback
End-to-End Automation

Featured Speakers

Mr. Michael Munsey

半導體產業全球副總裁, 西門子

Michael is the Global Vice President of the Semiconductor Industry at Siemens Digital Industries Software.

With over 35 years of experience in the semiconductor industry, Michael Munsey brings deep expertise in global business development, strategy, sales, and marketing to advance semiconductor technologies at Siemens.

Prior to Siemens, he held senior leadership roles at leading technology companies, including Perforce, where he served as Senior Vice President of Marketing and Strategy and led the acquisition and integration of Methodics; Dassault Systèmes, where as Vice President of the High Tech Industry he built and grew the company’s Semiconductor Industry business; and Cadence Design Systems, where he led the functional verification program and introduced the Incisive verification platform.

Michael began his career in semiconductor design at IBM after earning his degrees from Tufts University. He remains actively engaged in industry groups focused on standards development and the future direction of the semiconductor sector, and is a committed member and volunteer of Tau Beta Pi.