InP and GaAs advanced optical materials in advanced CMOS packaging.

下午 2:30 - 下午 2:55

This presentation will showcase several examples of how IIIV optical materials such as InP and GaAs can leverage advanced CMOS packaging for scale-up and scale-in use cases. 

 

Key Technologies Covered

  • Advanced packaging
  • IIIV optical materials
  • GaAs materials and supply chain
  • Optical interconnects
  • Fan out wafer level package

Featured Speakers

Mr. Matthew Sysak

Mr. Matthew Sysak

Chief Technology Officer, Lumentum

Matt Sysak is Chief Technology Officer at Lumentum where he leads technology strategy shaping the future of AI infrastructure. With more than 20 years of experience Matt brings deep technology and systems-level expertise to solve the most critical challenges facing optical interconnect for Scale up, Scale out, and Scale across applications.  Before joining Lumentum in 2024, Matt led laser and platform engineering at Ayar Labs and held senior roles at Intel, where his graduate research on hybrid silicon lasers was commercialized and has shipped millions of units. He holds MS and PhD degrees in Electrical and Computer Engineering from UC Santa Barbara and a BS in Chemical Engineering from Penn State.