Panel Level Advanced Packaging (PLP) introduces a wide variety of challenges addressed by glass

下午 4:00 - 下午 4:25

The rapid growth of AI accelerators and high-performance computing (HPC) devices is driving advanced packaging toward larger substrate sizes, higher interconnect density, and tighter warpage and reliability requirements. As a result, the industry is increasingly adopting Glass Core Substrate (GCS) technology to overcome the limitations of conventional organic core materials. Within this transition, SCHOTT BF33®, a borosilicate glass, has become one of the most widely used and commonly spec-in glass materials for GCS platforms targeting AI and HPC applications.

This presentation will focus on how SCHOTT BF33® enables manufacturable and scalable GCS solutions for AI and HPC packaging through its proven dimensional stability, low and well-matched coefficient of thermal expansion, excellent surface quality, and compatibility with fine-line redistribution and through-glass via (TGV) processing. The discussion will emphasize manufacturing readiness, repeatability, and yield performance, reflecting BF33®’s established position in customer specifications and qualification flows rather than early-stage development.

Beyond supplying a widely adopted material, SCHOTT supports customers across the AI and HPC packaging ecosystem with application-focused engineering services, including advanced fractography and failure analysis. By identifying crack initiation mechanisms, handling-related damage, and process-induced failures under large-body and high-density package conditions, SCHOTT helps substrate manufacturers and OSATs improve yield, reduce risk, and accelerate GCS deployment into high-volume AI and HPC production.

 

Key Technologies Covered

  • Glass Core Substrate (GCS) Platforms for AI & HPC
  • SCHOTT BF33® as a Widely Used, Spec‑In Glass Material
  • Through‑Glass Via (TGV) Processing and Reliability
  • Warpage Control for Large‑Body AI Packages
  • Panel‑Level Substrate Manufacturing
  • Fractography and Glass Failure Analysis
  • Yield Improvement in High‑Performance Packaging

Featured Speakers

Mr. Sean Chiu

邱政雄

新市場開發經理, 台灣首德股份有限公司

Sean Chiu holds a Master’s degree in Materials Science and Engineering from National Taiwan University and an Executive MBA from National Cheng Chi University. He has over 20 years of experience across the semiconductor, glass, metal, and industrial gas industries.

Sean is currently New Business Development Manager at SCHOTT AG, where he focuses on identifying emerging technology trends and driving new business opportunities, particularly in advanced materials for semiconductor applications. Previously, he served as Sales Excellence Manager, leading value-based selling initiatives, and as Senior Sales Manager, where he successfully expanded SCHOTT’s specialty glass business in Taiwan.

With a strong background in advanced packaging materials and ecosystem collaboration, Sean brings practical, market-driven insights to SEMICON Taiwan.