An Innovative Combo Panelization Platform Developed for Advanced Glass/Ceramic Core Substrates Manufacturing

下午 3:10 - 下午 3:35

The advanced glass/ceramic substrates for AI/HPC applications are attracting attention for their distinctive mechanical and thermal properties. However, their manufacture-ability with the regular build-up process such as for ABF is challenging. To fit the glass/ceramic cores to the existing production line, an innovative combo panelization platform was developed. Various thickness, dimension and shape of the glass cores were successfully panelized and completed fabrication with the normal ABF build-up process. This new platform is now under optimization and the relevant equipment will be set up for Production Verification Test (PVT). 

  

Key Technologies Covered

  • Glass/ceramic core substrate
  • Advanced packaging
  • Combo panelization
  • ABF build-up process

Featured Speakers

Dr. Chin-Sheng Wang

王金勝博士

副技術長, 欣興電子股份有限公司

Dr Wang received his Master and Doctorate in Chemical Engineering from National Taiwan University. He worked for Industrial Technology Research Institute (ITRI) from 1992 to 1997.

Jason Wang joined Unimicron since 1997 and devoted to IC substrate development for three years. Afterwards, he shifted to Subtron after Unimicron acquired this company in 2000. He served as the Vice President of Engineering in Subtron. He and his team focused on the development of substrates for the applications of RF and LED products in which the heat dissipation becomes more challenging. He and his team created many novel solutions and acquired many patents. He also has many years of experience and expertise in electroplating and surface finishing.     

He was back to Unimicron in 2016 and started to take over R&D department of PCB II business division as senior Vice President from September of 2017. He and his team dedicated to the development of PCB for high speed and high frequency, high power applications. He is currently in charge of the New Business Development Division and Advanced Technology Development Center as VCTO.