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Keynote: The Future of CMOS Image Sensors for the AI Era Driven by Heterogeneous Integration

下午 1:35 - 下午 2:05

Introducing the evolution of CMOS image sensors enabled by heterogeneous integration, including intelligent vision sensors integrating CMOS image sensors and AI chips, and their expanding role in real-world sensing in the AI era, with an outlook toward emerging opportunities in the physical AI domain.

 

Key Technologies Covered

  • CMOS Image Sensors
  • Heterogeneous Integration
  • 3D Stacking Process
  • Imaging and sensing technologies
  • Physical AI Systems

Featured Speakers

Mr. Masashi Nakazawa

Mr. Masashi Nakazawa

Senior General Manager, Sony Semiconductor Solutions Corporation

Masashi Nakazawa received his BS and MS degrees in Tokyo University of Science, Japan, in 1995 and 1997, respectively. He joined Sony Corporation in 2005 and was engaged in the development of process and integration technologies for various semiconductor devices. Currently, he is a senior general manager of research division at Sony Semiconductor Solutions Corporation, where he supervises the device, process, material, integration and packaging technologies for advanced image sensors and displays with a wide range of expertise from research to mass production.