X-Ray Technology for Advanced Semiconductor Manufacturing

上午 11:05 - 上午 11:30

With the ongoing scaling of semiconductor devices, achieving error-free production of new and high-performance IC chips is a particular focus on reducing manufacturing costs and increasing process efficiency to remain competitive. X-ray technology is an essential non-destructive tool for modern semiconductor manufacturing and advanced packaging in the production start-up of new chip generations. In this presentation, how the X-ray technology applied to the CD measurements of the nanosheet in the front end of the GAA manufacturing processes and the defect inspection of the 3D ICs and stacked chiplet packages will be discussed. At first, the X-ray metrology for CDs and thin films has been favored for the nanometer-scale sensitivity due to short X-ray wavelengths. In addition, the substantial penetration depth of X-rays in device-relevant materials can allow non-destructive access to buried stacks as required for characterizing the nanoscale structures of the GAA. Secondly, X-ray image is used to evaluate buried 3D architectures, identify microscopic defects like voids and bridging, and precisely measure critical dimensions of sub-micron structures without destroying the chip in the advanced packaging. In conclusion, with continued advances in laboratory X-ray sources, and AI-driven data analysis, X-ray technology are poised to play an increasingly role in the advanced semiconductor manufacturing to meet the demands of high-resolution, multi-dimensional structural analysis non-destructively for the high quality control.

Key Technologies Covered

X-Ray Metrology and Inspection
Small Angle X-Ray Scattering
X-Ray Reflectivity
X-Ray Image
Critical Dimensions
Defect Inspection

Featured Speakers

傅尉恩博士

副執行長, 工業技術研究院

Wei-En Fu received his bachelor in Mechanical Engineering at the National Cheng Kung University, Taiwan, in 1990. He later obtained his PhD in Industrial and Manufacturing Engineering from the Pennsylvania State University, US, in 2003. Currently, he is Deputy General Director of the Center for Measurement Standards (CMS) at the Industrial Technology Research Institute (ITRI). With a diverse background in both mechanical and industrial engineering, he has been involved, coordinated and principal-investigated projects in nanometrology and semiconductor metrology in CMS/ITRI. His research activities focus on the development of X-Ray Metrology, Thin Film Metrology and Nanometrology for the advance semiconductor manufacturing processes, particularly in the fields of Critical Dimensions Small Angle Scattering and X-Ray Reflectivity in Semiconductor Metrology.