Fireside Chat: Technology, Trust, and the Responsibility of Innovation

Dr. Tien Wu is the Chief Executive Officer of Advanced Semiconductor Engineering, Inc. (ASE) and concurrently the Chief Executive Officer of Universal Scientific Industrial Co., Ltd. (USI). He is also a member of the Board of Directors and Chief Operating Officer of the ASE Technology Holding Co., Ltd. (NYSE: ASX, TWSE: 3711).

Tien serves as a Vice Chairman of SEMI Board and Board Member of the Global Semiconductor Association (GSA), which are global industry associations serving the manufacturing supply chain for the micro- and nano-electronics industries.

Prior to joining ASE, Tien held several management positions within IBM including R&D, manufacturing and sales in the United States, Europe and Asia-Pacific. He holds twelve U.S. patents and has authored over twenty-five articles. Tien holds a BSCE degree from National Taiwan University, and also earned MS and Ph.D. degrees in mechanical engineering and applied mechanics respectively from the University of Pennsylvania. In 2015, Tien received an Honorary Degree of Doctor of Science from Binghamton University. In 2024, Tien was elected to the United States National Academy of Engineering, for sustainable electronics manufacturing and advancements in the high-volume production of semiconductor packaging. 

Education

Ph.D., Electrical and Computer Engineering, Syracuse University, USA

Experience

• Senior Vice President, Europe and Asia Sales, TSMC
• Senior Vice President, Technology Development, TSMC
• Vice President, Technology Development, TSMC
• Senior Director, Design and Technology Platform, TSMC

Biography

Dr. Cliff Hou is Senior Vice President, Deputy Co-COO and Chief Information Security Officer at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). He is also deputy of Mr. Y.P. Chyn. Prior to this post, Dr. Hou was TSMC's Vice President of Design and Technology Platform from August 2011 to July 2018 and later he served as Vice President of Technology Development in August 2018. He began his career at TSMC in 1997 and has since played a key role in the Company's design technology and ecosystem development.

From 1997 to 2007, Dr. Hou established the company's technology design kit and reference flow development organizations. Over the last decade, Dr. Hou led the development of TSMC's Open Innovation Platform® (OIP), which is now the most comprehensive design ecosystem in the global semiconductor industry.

Dr. Hou received the National Manager Excellence Award in 2010 as a pioneer in reference flows and design for manufacturing (DFM) that significantly lowers IC design barriers. He led the Company's OIP project team to win the first National Industry Innovation Award in 2011, presented by the Taiwan Ministry of Economic Affairs (MOEA).

Prior to joining TSMC, Dr. Hou was a section manager specializing in design environment at the Computer & Communications Research Laboratories, Industrial Technology Research Institute (ITRI/CCL) in Taiwan. He also served as an Associate Professor at Kaohsiung Polytechnic Institute (now known as I-Shou University) in Taiwan.

Dr. Hou holds 44 U.S. Patents and serves as a member of Board of Directors in Global Unichip Corp. He received B.S. degree in Control Engineering from Taiwan's National Chiao-Tung University, and Ph.D. in Electrical and Computer Engineering from Syracuse University.

蔡力行博士（Dr. Rick Tsai）現為聯發科技副董事長暨執行長，並於 2023 年榮獲全球半導體聯盟（GSA）頒發「張忠謀博士模範領袖獎」。聯發科技是一家全球無晶圓廠半導體公司，在智慧手持裝置、智慧家庭應用、無線連結技術、物聯網產品、車用、資料中心等領域的系統單晶片（SoC）位居領先地位；每年約有 20 億台內建聯發科技晶片的終端產品在全球上市。

自 2017 年加入聯發科技以來，蔡博士帶領團隊屢創營收新高，並於多個市場建立全球領先地位。在他的領導之下，聯發科技持續投資先進技術、擴充產品組合，並不斷拓展其在亞洲、北美、歐洲和日本的市場版圖。

蔡博士在加入聯發科技之前，於 2014 年至 2016 年擔任台灣最大電信業者中華電信公司董事長；在他的領導下，台灣 4G 服務創下全球成長之冠。蔡博士更於任職期間，獲《亞洲金融》評選為 2016 年台灣三大最佳執行長之一。

蔡博士於 1989 年加入台積公司擔任工程經理，之後歷任多項重要管理職位，包含晶圓廠廠長、營運執行副總經理、全球業務與行銷執行副總經理、總經理暨營運長，並於 2005 年升任台積公司總經理暨執行長。在1998 年至 2000 年於台積公司服務期間，蔡博士亦擔任其子公司世界先進積體電路公司總經理，並於 2009 年至 2011 年轉任台積公司新事業總經理；此後，更同時擔任台積太陽能公司和台積固態照明董事長兼執行長，直至 2014 年。

1981 年至 1989 年間，蔡博士於美國惠普公司（Hewlett Packard）服務，擔任 IC 工程經理。

蔡博士曾擔任多家公司董事，包括台灣半導體產業協會、科林研發（Lam Research）、恩智浦半導體（NXP Semiconductors）、台灣聚合、中華電信、台積公司和聯發科技。

蔡博士畢業於國立臺灣大學物理學系，並於 1981 年取得美國康乃爾大學材料科學暨工程博士學位。

劉揚偉，1978年畢業於國立交通大學電子物理系，1986年取得美國南加州大學電子工程與電腦科學碩士學位，2023年獲頒國立陽明交通大學名譽博士學位。1988年，劉揚偉開啟創業之路，在美國自創主機板品牌 Young Micro，後於1994年併入鴻海公司，進一步協助鴻海科技集團跨入電腦系統業務領域。隔年，劉揚偉在美國矽谷創立IC設計公司 ITE Tech，以個人電腦晶片為主要產品，並於1997年創立 ITeX，以 ADSL 晶片產品為主。ITeX 於2001年成功在納斯達克 NASDAQ 上市。

2007年，劉揚偉獲鴻海科技集團創辦人郭台銘延攬，加入鴻海擔任董事長特助一職，2010年接任B事業群總經理，並於2014年4月兼任 IC 設計服務公司虹晶科技董事長，2016年被選為夏普株式會社董事，同年10月成立鴻海S半導體事業群並擔任總經理。2019年經鴻海董事會通過，當年度7月1日正式接任鴻海董事長一職。劉揚偉目前亦是京鼎精密科技股份有限公司董事長、2024年6月擔任夏普株式會社會長一職、2025年5月擔任台灣區電機電子工業同業公會理事長。

劉揚偉管理的鴻海科技集團為全球最大科技製造與服務商、《財富雜誌》（Fortune）全球27大企業，產品範圍涵蓋消費智能產品、雲端網路產品、電腦終端產品、元件及其他等四大產品領域，集團事業版圖橫跨全球24個國家/地區，全球員工總人數季節性高峰大約九十萬人。鴻海科技集團2025年全年營業額新台幣8.1兆元，是全台灣營收最大也是首家年營收飛越8兆元大關的企業。

2019年，劉揚偉宣布集團將積極投入「電動車、數位健康、機器人」三大新興產業以及「人工智慧、半導體、新世代通訊技術」三項新技術領域，以「3+3」作為鴻海重要的長期發展策略。近年來，劉揚偉推動鴻海從製造服務公司轉型為智慧製造、智慧電動車、智慧城市，三大智慧平台解決方案供應商！

2024年劉揚偉獲得印度政府頒發公民榮譽獎「Padma Bhushan 蓮花裝勳章」表彰其對印度社會的重要貢獻。劉揚偉致力於鴻海的數位轉型，鴻海為台灣唯一連續七年（2018-2024）獲得科睿唯安 (Clarivate)「全球百大創新機構 (Top 100 Global Innovators)」的民營企業，劉揚偉本人更陸續獲得《哈佛商業評論》「台灣CEO 100強」、「數位轉型領袖」，以及機構投資者「亞洲科技硬體類最佳CEO」等殊榮。

S.C. Chien currently serves as Chairman and Chief Strategy Officer of Unimicron Technology Corp., leading the company’s strategic direction across the electronics and semiconductor supply chain.

S.C. Chien obtained a Bachelor’s degree in Chemical Engineering from National Taiwan University and brings over 40 years of semiconductor experience. He previously served as Co-President of UMC, overseeing manufacturing, R&D, and operations. Besides, throughout his years at UMC, he led multiple functions including ATD (Advanced Technology Development), STD (Specialty Technology Development), CE (Customer Engineering), TTD (Technology Transfer and Development), IPDS (IP & Design Support), CM (Corporate Marketing).