Dr. Don Son Jiang

Dr. Don Son Jiang holds a Ph.D. in Materials Science and Engineering from National Cheng Kung University.  With over 20 years of expertise in the semiconductor IC packaging industry, his career spans from foundational research to strategic leadership.  

In his early career, Dr. Jiang focused on packaging material development, structural design, and characterization.  He was instrumental in establishing standardized R&D processes within SPIL and served as the Vice Chair of the SEMI Materials Committee. 

In recent years, Dr. Jiang has spearheaded the development and strategic deployment of advanced packaging technologies.  By leading his team to achieve breakthroughs in 2.5D and Fan-out packaging, he has successfully transitioned these technologies into high-volume manufacturing, solidifying SPIL’s position as a global leader in advanced packaging.  Currently, he oversees the entire R&D Center's operations, focusing on the continuous evolution of next-generation semiconductor solutions.