陳明發

With a 30-year tenure at TSMC, I have consistently driven technical value through relentless innovation, amassing a portfolio of over 440 US patents. In the field of advanced packaging, I have led the development of numerous industry-leading technologies, including 12µm/5µm/2µm TSVs and fingerprint sensor chips, as well as key innovations such as CoWoS-S, SoIC, and COUPE—all of which now serve as the foundation of TSMC’s 3DFabric™ platform. Currently, I lead the Photonics Packaging Integration department, where I am dedicated to delivering cutting-edge optoelectronic solutions for next-generation HPC and AI.