Enabling Co-Packaged Optics: Wafer Processing Impacts in Next-Gen Photonic Integration

下午 1:50 - 下午 2:10

The demands for high bandwidth, low latency and low power consumption are driving the integration of photonic and electronic circuits in Data Centre networks. Pluggable transceivers are available today where the optical components are plugged into the package containing the Si devices. The future trend is towards Co-Packaged Optics (CPO) involving heterogeneous integration into a single package. The implications of this transition will be discussed with particular emphasis on the wafer processing steps. These include the existing processes for discrete photonics, micro-machining of Si to enable chiplet and fiber integration, processing of compound semiconductor layers on 300mm Si wafers and packaging.

Key Technologies Covered

Heterogeneous Integration
Co-Packaged Optics
Plasma Etch Processing of Si and Compound Semiconductors
Chemical Vapor Deposition
Physical Vapor Deposition

Featured Speakers

Mr. Tarran Grange

Etch Product Manager, KLA Corporation

Tarran Grange joined SPTS Technologies in 2016 as an Etch Process Engineer. In 2019, SPTS was acquired by KLA Corp. In 2021, he joined the Etch Product Management team. His role within the team covers all aspects of marketing as well as provision of technical support to the worldwide sales team. Tarran has a BSc in Physics from University of Hull and an MSc in Fusion Energy from the University of York.