Fireside chat - From silicon to systems: Scaling AI infrastructure

3:15 pm - 3:30 pm

As AI systems scale, the challenge is no longer just about faster compute. Compute, memory, connectivity, advanced packaging, power and cooling increasingly need to evolve together, creating new technology bottlenecks and new opportunities across the AI infrastructure value chain.

With its unique perspective across this stack, Foxconn is seeing these challenges emerge at scale. This fireside chat will explore what the next generation of AI infrastructure will demand from the semiconductor technology roadmap, and where breakthroughs will be needed.

The conversation will also look at how Taiwan can build on its world-leading semiconductor ecosystem to capture a broader role across the AI infrastructure value chain, and how closer collaboration between system leaders and advanced R&D can help accelerate that transition.

Featured Speakers

Patrick Vandenameele

Dr. Patrick Vandenameele

CEO, imec

Patrick Vandenameele is Chief Executive Officer at imec  - a globally recognized R&D center specializing in nanoelectronics and digital technologies - since April 1, 2026. His leadership underpins imec’s commitment to addressing market-driven application challenges while advancing its world-class technology platforms through targeted internal investments and external collaborations.

Prior to this appointment as CEO, he served as Executive Vice President and Co-Chief Operating Officer at imec, where he was overseeing and shaping the organization's R&D strategy and its execution. In this position, Patrick was responsible for shaping and driving the center’s innovation agenda, ensuring the alignment of research initiatives with emerging market needs, partner priorities and technological frontiers. Previously, as chief portfolio officer at imec until early 2024, he spearheaded strategic initiatives spanning business development, portfolio management, and venture creation. 

Holding a PhD from KU Leuven, Patrick began his journey with imec in 1996, contributing to the wireless communications program. In 2000, he transitioned to entrepreneurship, founding and leading several deep-tech ventures, three of which were built on imec technology. Patrick also held senior positions at top semiconductor firms like Qorvo and Hisilicon/Huawei, leading 11 product launches and overseeing over 100 million units shipped. After returning to imec in 2017, Patrick has been instrumental in expanding imec’s venture development activities, working closely with the deep-tech venturing fund imec.xpand to strengthen imec’s position as a pioneer in technology-driven solutions. 

bob

Dr. Bob Wei-Ming Chen

President S (Semiconductor) Business Group, Foxconn

Dr. Bob Wei-Ming Chen is currently the president of Foxconn S business group in charge of semiconductor business. He began his career at Motorola Advanced Product Research Laboratory (Austin, Texas) in 1994, working on PowerPC (CPU) and embedded memory R&D. He was with TSMC as a deputy director in charge of advanced logic technology development, later he joined TSMC’s subsidiary Xintec Inc. as R&D VP, pioneering wafer-level packaging and 3DIC packaging. He was an entrepreneur founded MOS Art Packaging. He spent 6 years of his career with Neo Solar Power as president of the cell business unit. Since 2017, he has been with Foxconn Technology Group, establishing 7 semiconductor start-ups and serves as chairman and board member of various semiconductor companies in Foxconn group.

He has published over 40 academic papers and 30 patents. He obtained his B.S. degree from National Tsing Hua University in Materials Science and Engineering, M.S. and Ph.D. degrees from The University of Texas at Austin, USA, EMBA degree from National Chiao Tung University in Taiwan.