Dr. Bob Wei-Ming Chen

Dr. Bob Wei-Ming Chen is currently the president of Foxconn S business group in charge of semiconductor business. He began his career at Motorola Advanced Product Research Laboratory (Austin, Texas) in 1994, working on PowerPC (CPU) and embedded memory R&D. He was with TSMC as a deputy director in charge of advanced logic technology development, later he joined TSMC’s subsidiary Xintec Inc. as R&D VP, pioneering wafer-level packaging and 3DIC packaging. He was an entrepreneur founded MOS Art Packaging. He spent 6 years of his career with Neo Solar Power as president of the cell business unit. Since 2017, he has been with Foxconn Technology Group, establishing 7 semiconductor start-ups and serves as chairman and board member of various semiconductor companies in Foxconn group.

He has published over 40 academic papers and 30 patents. He obtained his B.S. degree from National Tsing Hua University in Materials Science and Engineering, M.S. and Ph.D. degrees from The University of Texas at Austin, USA, EMBA degree from National Chiao Tung University in Taiwan.