Mr. Barry Yeh

Po-Han (Barry) Yeh is the Project Manager of Sales & Technical Affairs at WinWay Technology, where he serves as the company-wide technical liaison bridging customer applications and internal R&D across the test interface portfolio. He brings nearly nine years of hands-on experience spanning process engineering, test interface R&D, and team leadership, with an M.S. in Materials and Optoelectronic Science from National Sun Yat-sen University.

Barry is the original concept originator and lead designer of HyperSocket, WinWay’s flagship cross-generation test socket technology developed specifically for high-performance and AI workloads, and a key inventor on its global patent portfolio spanning 14 filings across five jurisdictions. His technical work has centered on design-for-testing principles at the contact interface — including material validation across metals, plastics, and ceramics, structural optimization for next-generation device requirements, accelerated life-cycle test methodology, and root-cause analysis of complex contact-induced failure mechanisms.

He has led the establishment of in-house contact-component production capabilities and built SLT/ATE-to-lab measurement correlation methodologies that bridge design intent with real-world test outcomes. His current focus extends into Co-Packaged Optics and Silicon Photonics test methodologies, addressing the reliability challenges that emerge as AI accelerators push conventional electrical and optical test paradigms to their limits.