xMEMS Labs, Inc.

Ms. Jillian Sun, Director, Corporate Strategy, xMEMS Labs, Inc.

Jillian Sun is Director of Corporate Strategy at xMEMS Labs, the fabless semiconductor company behind µCooling, the industry's first solid-state, all-silicon active cooling chip. 

She leads xMEMS' fundraising and corporate development function, and designed the company's data-center go-to-market strategy, developing strategic partnerships across the data center ecosystem. Her market work spans market analysis for the company's thermal and audio product lines, and new-application research identifying piezoMEMS opportunities in optical circuit switching (OCS) and thermal management for humanoid-robot joints and motors. Before joining xMEMS, Jillian spent nearly 10 years at Goldman Sachs in Taipei, rising from Analyst to Vice President as the firm's Taiwan technology sector specialist. She also advises the Technology Competitiveness & Industrial Policy Center (TCIP) as an independent strategy consultant, authoring policy research on the US semiconductor ecosystem. Jillian holds an M.S. in Management from Stanford Graduate School of Business (Sloan Fellow MBA) and a B.B.A. in Finance from National Taiwan University. She is bilingual in Mandarin and English.

 

Topic: 

A Chip That Cools Chips: Solid-State Active Cooling from Edge AI to Data Centers

 

Abstract:

AI is now limited by physics, not compute. Every AI form factor hits its thermal ceiling before its compute ceiling. 

At the edge, phones and AI wearables throttle because passive cooling is no longer enough: vapor chambers and graphite only spread heat toward a skin-temperature-limited surface, and sustained on-device inference saturates them. Fans at millimeter scale are ineffective, inefficient, and incompatible with compact, vibration-sensitive devices. 

In data centers, liquid cooling removes roughly 80% of rack heat, but only where cold plates touch. The remaining heat is trapped in stagnant air, where hot spots and thermal gradients quietly erode throughput and reliability. Extending liquid to every component adds cost, leak risk, and complexity. 

At both ends of AI hardware, conventional cooling has hit its physical limits. xMEMS' answer is a chip that cools chips: µCooling, a solid-state, 1-mm-thin piezoMEMS air pump, designed and fabricated as silicon and integrated like any other semiconductor component. This talk presents an optimal, precision active cooling solution that increases thermal budgets for applications across edge and cloud: smartphones, AI wearables, SSDs, optical transceivers, co-packaged optics, and GPU packages.

 

Key Technologies Covered:

  • Solid-state piezoMEMS active cooling, "fan-on-a-chip" (µCooling)
  • Ultrasonic modulation and demodulation
  • Thermal limits of AI hardware from edge to cloud: smartphones, wearables, fan-less devices, liquid-cooled racks, robotics
  • SSDs and memory (M.2, E3.S)
  • OSFP transceivers and co-packaged optics (CPO)
  • GPU package and BGA-field thermal management
  • Hybrid cooling architecture: liquid cold plates + targeted micro-convection