Robichip Technology Co. Ltd.

Mr. Ben Huang, Assistance to CEO, Robichip Technology Co. Ltd.

Ben Huang is Special Assistant to the CEO and a founding member of RobiChip Technology Co., Ltd. He supports corporate strategy, technology commercialization, strategic partnerships, and cross-functional execution for the company’s Power SoC and intelligent motion platforms.

With a multidisciplinary background spanning analog integrated-circuit design, DC/DC converters, power-system integration, and software development, he bridges semiconductor engineering with product strategy, customer engagement, and ecosystem development. He is also actively advancing RobiChip’s transformation into an AI-driven company by integrating agentic AI into hardware and circuit-design workflows to accelerate engineering development and organizational execution.

He received his B.S. degree in Electronic and Computer Engineering from National Yang Ming Chiao Tung University (NYCU), Taiwan, in 2021, and subsequently pursued doctoral research at NYCU’s Institute of Electronics.

He also contributed to RobiChip receiving the Excellent Work Award at the 2026 Best AI Awards, distinguishing the company among 1,487 participating startup teams.

 

Topic:

Semiconductor-Defined Motion: High-Power-Density Motor Drive Modules for Robotics and UAVs

 

Abstract:

Robotics and UAV companies are demanding smaller, lighter, and more powerful motion systems, but conventional motor-drive solutions remain fragmented across control ICs, power devices, sensing, protection, packaging, and thermal management. This complexity increases system size, development time, and integration risk.

RobiChip is building a semiconductor-defined motion platform that integrates Power SoC technology, high-power-density motor drives, advanced thermal architecture, and AI-assisted engineering. Its RobiSoC platform brings control, power delivery, sensing, and protection closer together, while RobiDev and RobiThrust enable customers and partners to validate the technology in robotics and UAV propulsion applications.

At SEMICON Taiwan 2026, RobiChip will present its silicon-to-system strategy, current engineering validation, and commercialization roadmap. The pitch will also highlight how agentic AI is being applied to accelerate circuit design, engineering analysis, customer design-in, and technical support. RobiChip is seeking semiconductor, packaging, motor, system-integration, and strategic partners to jointly develop the next generation of compact, efficient, and production-scalable intelligent motion platforms.

 

Key Technologies Covered:

  • Power SoC integration for intelligent motion systems
  • High-power-density motor-drive modules
  • GaN power stages and high-frequency power conversion
  • Integrated motor control, current sensing, and protection
  • Hybrid-substrate and thermal-aware power packaging
  • Package-to-system thermal management and heat extraction
  • Modular RobiDev platform for customer evaluation and design-in
  • RobiThrust propulsion validation for UAV applications
  • System-level power, thermal, efficiency, and reliability validation