Mr. Steven Duggan

Steven Duggan is a Senior Principal Engineer specializing in the development and industrialization of advanced semiconductor packaging equipment. He has deep domain expertise spanning high-density 2.5D/3D silicon integration, advanced die-to-die interconnects, and backside power delivery technologies. Since 1995, Steven has held diverse engineering and supply chain leadership roles across silicon fabrication, technology development, and high-volume assembly and test manufacturing.

Throughout his career, he has led first-of-a-kind equipment engagements, establishing novel process capabilities for flip-chip and wafer-level assembly processes. His expertise lies in defining equipment architectures, maturing process capabilities, and retiring technical risks from early feasibility to high-volume manufacturing. Previously, Steven managed a 26-person R&D and capital commodity organization, driving global equipment strategy, supplier alignment, and lifecycle asset management. He is recognized for combining deep technical execution with cross-functional leadership to scale advanced packaging roadmaps.