AI-Driven Heterogeneous Integration: Accelerating the Future of High-Performance Computing
11:35 am - 12:00 pm
Heterogeneous integration is reshaping semiconductor innovation through chiplet architectures, advanced 2.5D/3D packaging, HBM integration, and hybrid bonding technologies. Driven by AI and HPC demands, the industry is evolving from chip-centric design to system-centric optimization. Leveraging Cadence's three-layer strategy of Design Excellence, System Innovation, and Pervasive Intelligence, AI-enabled workflows, multi-physics analysis, and intelligent system design are accelerating the development of next-generation heterogeneous computing platforms.
Key Technologies Covered
Agentic AI in IC Design
EDA
Advanced Packaging
Chiplet
