From Wafer to Panel: The Next Evolution in PVD for Interposer RDL

As interposer RDL transitions from wafer-based manufacturing toward panel substrates, physical vapor deposition (PVD) processes must evolve to meet new technical demands. This presentation explores the challenges and opportunities of applying proven wafer-level PVD expertise to 310 mm square panel processing. While panel formats offer the potential for improved output, lower cost per package, and enhanced manufacturing scalability, they also introduce significant hurdles for substrate transport, contamination management and on-wafer performance that ultimately impact capability and yield.  

Drawing on decades of PVD experience in semiconductor wafer fabrication, we examine how established knowledge in thin-film deposition, process control, and hardware design, along with state-of-the-art computational modelling, can be utilized for panel-level manufacturing. Attendees will gain insight into the technologies and innovations required to enable reliable, high-volume panel-level packaging and support the next generation of heterogeneous integration