Tailored Light: Next-Gen Laser Solutions for High-Throughput, Low-CoO Fabrication
Advanced laser technology is transforming the semiconductor lifecycle — providing the precision and versatility required for next-generation device fabrication. From front-end processing to advanced packaging, laser-based solutions are setting new standards for yield and throughput in a rapidly evolving industry. Ultra-short pulse (USP) lasers enable a broad spectrum of critical applications of various brittle materials including high-speed via drilling of interposer and substrates, precise surface grooving, dicing, and selective annealing of wafers.
The key to unlocking these advanced processes lies in our unique core competency: tailored spatial and temporal beam shaping, which perfectly customizes the laser profile to the specific application. By leveraging non-thermal ablation mechanisms these laser systems achieve sub-micron accuracy across wafers and panels. This approach ensures superior quality with smooth, crack-free edges and minimal heat-affected zones, effectively eliminating particle generation and thermal damage. Ultimately, this unmatched process control translates into maximum die yield and highly accelerated throughput, driving down the overall Cost of Ownership (CoO) for high-volume manufacturing.
Key Technologies Covered
- Tailored spatial and temporal beam shaping
- Ultra-short pulse lasers for critical applications of various brittle materials
- High-speed via drilling of interposer and substrates
- Precise surface grooving, dicing, and selective annealing of wafers
