Energy-Efficient Operation of Distributed Sub-fab Gas Emission Control Systems

2:30 pm - 2:55 pm

Advances in semiconductor device structures and increasing environmental requirements have significantly raised the load on gas abatement systems. The adoption of 3D device technologies such as Wafer-to-Wafer bonding and Die-to-Wafer bonding has increased deposition-forming process gases, generating large amounts of solid by-product powders that accumulate in dry pumps, abatement units, and exhaust ducts. These powders cause choking and reduce overall facility uptime. In addition, PFC abatement requires extremely high temperatures to decompose stable CxFy gases, resulting in continuous energy consumption because most abatement systems cannot rapidly adjust their thermal output.

Foreline plasma treatment upstream of dry pumps offers an effective solution. It can decompose PFC gases and gasify solid powder like SiO2 before they reach downstream equipment, allowing abatement systems to operate at lower temperatures, reducing maintenance frequency, and improving uptime. Because plasma can be switched on and off within a few ms, it operates only when gases are flowing, keeping average power consumption low. Distributed processing around dry pumps is therefore highly effective for addressing increasing gas loads, particulate issues, and energy-efficiency demands. Here, we also introduce a low‑pressure abatement system that enables significant reduction of the large amounts of nitrogen typically required for diluting flammable gases during treatment.

 

Key Technologies Covered 

  • Gas emission control
  • Foreline plasma treatment
  • PFC gas decomposition
  • Powder gasification
  • Pre-/post- pump distributed operation
  • Uptime improvement in sub-fab

Featured Speakers

Dr. MICHIHIKO YANAGISAWA

Dr. MICHIHIKO YANAGISAWA

General manager, Kanken Techno Co., Ltd.

Dr. YANAGISAWA is the Director and General Manager of the Technology Development Division at Kanken Techno Co., Ltd. He received his Ph.D. in Engineering from the Graduate School of Engineering, The University of Tokyo in 2003, and the research conducted during his doctoral studies later provided the foundation for the development of the NC‑LDE (Numerically Controlled Local Dry Etching) technology, a localized plasma‑based dry etching system capable of producing ultra‑flat silicon wafers. This technology enabled the fabrication of highly planarized Si wafers and contributed to the continued miniaturization of semiconductor devices.

His areas of expertise include plasma etching and plasma reaction engineering, and he has been extensively involved in the research and development of advanced plasma processing technologies throughout his career. His current responsibilities include leading the development of high‑performance, high‑function, and energy‑efficient abatement systems, contributing to improved environmental performance and productivity in semiconductor manufacturing.

He is currently engaged in the development of new, energy‑efficient, and environmentally friendly exhaust‑gas treatment systems for semiconductor manufacturing facilities, advancing technologies that reduce environmental impact while maintaining high operational performance.