Zsolt Tőkei is fellow, and program director of 3D System Integration at imec. He joined the organization in 1999 and, since then, has held various technical positions. First, as a process engineer and researcher in the field of copper low-k interconnects, then headed the metal section. Later he became principal scientist, and program director of nano-interconnects and more recently transitioned to 3D System Integration. He earned a M.S. (1994) in physics from the University Kossuth in Debrecen, Hungary. In the framework of a co-directed thesis between the Hungarian University Kossuth and the French University Aix Marseille-III, he obtained his Ph.D. (1997) in physics and materials science. In 1998, was with Max-Planck Institute of Düsseldorf, Germany, as a post-doctorate researcher. Joining imec, he continued working on a range of interconnect issues, including scaling, metallization, electrical characterization, module integration, reliability, and system aspects. He authored or co-authored more than 500 scientific papers and conference publications, holds over 30 patents, served as committee member of IRPS, IEDM, IITC.
