Patrick Heissler

Patrick Heissler is the CEO of SCRONA AG. Patrick’s career is filled with leadership and innovation success. He has held notable roles like Corporate Chief Commercial Officer at Focuslight Technologies and Chief Strategy Officer at SUSS MicroOptics , where he led the successful carve-out out of SUSS MicroTec. At DELO Industrial Adhesives, he spearheaded the micro-optics materials business, driving significant growth and market influence, and as CTO of UltraFast Innovations, he played a pivotal role in surpassing the company’s first million in revenue. Patrick’s academic background is equally impressive. He earned a doctorate in physics from the prestigious Max Planck Institute for Quantum Optics, with research at the University of Utah and Los Alamos National Laboratory. In addition, he holds an MBA in Innovation and Business Creation from the Technical University of Munich, with further studies at UC Berkeley’s Haas School of Business.

Theme: Ultra-High Precision, Massively Parallel Printing: Redefining Micro-Fabrication

Abstract of Presentation

Scrona is pioneering a new era of micro-fabrication with its inklogic printhead platform, the world’s first scalable, software-defined technology enabling submicron, additive patterning on virtually any surface. At the heart of inklogic lies a multi-nozzle MEMS architecture that unlocks semiconductor-level precision for printing functional materials, ranging from metals and polymers to quantum dots, with unmatched flexibility and throughput. In January 2025, Scrona introduced the world’s first 128-nozzle inklogic printhead, establishing a breakthrough in high-volume manufacturing of next-generation devices such as UWB antennas, 2.5D interconnects, and microdisplay packaging. The platform’s wafer-level production scalability, combined with its ability to print on 3D surfaces and across a wide viscosity range, positions inklogic as a transformative enabler for advanced semiconductor and display applications. This presentation will showcase how Scrona is moving beyond lab-scale demonstrations to real industry adoption, with early projects underway with leading OEMs and device manufacturers. Attendees will gain insight into how inklogic redefines additive manufacturing for electronics, bridging today’s production challenges with tomorrow’s requirements for flexibility, precision, and cost efficiency.

Key Technologies Covered

• Sub-10 µm additive printing for advanced packaging 
• Fine-pitch redistribution layers (RDL) without masks 
• Conformal metallization on 3D topographies 
• High-density interconnects for chiplet integration