Call for Speakers

We are pleased to invite your team to pitch on the Silicon Startups Stage, a dedicated platform for semiconductor startups within the SILICON STARTUPS ZONE at SEMICON Taiwan 2026. This is a unique opportunity to present your breakthrough technologies to global industry leaders, investors, and strategic partners, while gaining visibility and accelerating your path to commercialization.

Why Participate

• Present a 10-minute pitch featuring your core technologies, innovative solutions, and growth-ready business models.
• Gain exposure to SEMICON Taiwan’s global audience, including leading manufacturers and investors.
• Accelerate business growth through matchmaking opportunities with industry stakeholders.

1. Advanced Front-end Manufacturing & Transistor Architectures
Focus: Next-generation logic and memory scaling beyond 2nm.
Scope:

• Gate-All-Around (GAA), CFET, 2D materials
• ALD/EUV innovations and advanced front-end materials/equipment
• Novel memory technologies (RRAM, MRAM, FeRAM, etc.) and in-memory compute devices
• Next-node process development and enablement

2. Advanced Packaging & Heterogeneous Integration
Focus: Performance enhancement via system-level integration.
Scope:

• 2.5D/3D IC, chiplet interconnects (UCIe)
• CoWoS, FOWLP, and Hybrid Bonding technologies
• Advanced interposers (silicon/organic/bridge) and high-speed I/O for chiplets
• Panel-level packaging and chiplet communication protocols

3. AI, Edge Computing & Next-Gen Compute Architectures
Focus: The brain of modern systems—from cloud to edge and on-device AI.
Scope:

• AI accelerators, NPU, and neuromorphic computing
• RISC-V based solutions and high-performance SoC design
• In-memory compute and analog AI architectures
• Edge AI processors and low-power inference engines

4. Silicon Photonics & Optical Interconnects
Focus: Solving the data bottleneck with light.
Scope:

• Co-Packaged Optics (CPO) and Photonic Integrated Circuits (PIC)
• Optical I/O for data centers and AI clusters
• Optical switch fabrics and photonic computing elements
• High-speed optical transceivers and coherent optics

5. Quantum Computing & Cryogenic Electronics
Focus: Computing paradigms for the future, including quantum sensing and communication.
Scope:

• Quantum processors (QPU): superconducting, ion trap, atomic array, and photonic quantum
• Quantum error correction and fault-tolerant architectures
• Specialized control chips and materials for cryogenic environments
• Quantum sensing and quantum communication technologies

6. Smart Sensing, Robotics & MEMS Technologies
Focus: The senses of AI systems and autonomous machines.
Scope:

• Advanced CMOS Image Sensors (CIS), LiDAR, and Time-of-Flight (ToF) sensors
• MEMS and sensor fusion technologies
• Autonomous driving and AMR/robotics platforms
• Industrial sensing and edge AI integration

7. Power Semiconductors & Wide Bandgap (WBG) Materials
Focus: Energy efficiency and electrification across EV, renewable energy, and data centers.
Scope:

• SiC (Silicon Carbide) and GaN (Gallium Nitride) devices
• Next-generation PMICs and high-efficiency power conversion
• Power modules, drivers, and packaging for EV, renewable, and data center applications
• Advanced thermal management and integration solutions

8. EDA, Design Verification & Yield Analytics
Focus: The digital backbone of chip quality and efficiency—from design closure to in-field lifecycle analytics.
Scope:

• AI-driven EDA and Design-for-Test (DFT) tools
• Silicon Lifecycle Management (SLM), metrology, and Yield Management Systems (YMS)
• ML-based test optimization and fab digital twin technologies
• Manufacturing analytics and in-field reliability monitoring

9. Sustainable Manufacturing & Green Semiconductor Technologies
Focus: ESG and resource efficiency in fab operations, aligned with global decarbonization goals.
Scope:

• Carbon capture, water recycling, and energy-efficient facility management
• Circular economy for semiconductor materials and recycling
• Process chemicals, abatement systems, and novel materials for lower-carbon fabs
• Green AI and sustainable data center power architectures

✔Technologies must be in early commercialization, pilot production, or pre-mass-production stages and should not yet be widely available in the commercial market.

✔Company must be in a fundraising or early commercialization stage.

✔Please complete the Silicon Startups Stage Pitch Application Form by June 30, 2026.

✔Submissions will be evaluated based on alignment with event themes and presentation availability.

Contact our team to learn more about participation!
[email protected]