Taipei, Taiwan, August 2025 – SENKO Advanced Components, a global leader in optical interconnect solutions, proudly announces the launch of its detachable Metallic PIC Connector (MPC) at SEMICON Taiwan 2025. This breakthrough innovation marks a pivotal advancement in fiber-to-chip connectivity for next-generation photonic integrated circuits (PICs).
The detachable MPC introduces a new level of flexibility and serviceability to optical packaging. Unlike traditional fixed connectors, SENKO’s detachable MPC allows fiber-optic cables to be disconnected and reconnected during the packaging process, eliminating the need to endure solder reflow and enabling hot-swap capability for field maintenance. This dramatically reduces lifecycle costs and enhances modularity in high-volume manufacturing environments
Key Features of SENKO’s Detachable MPC:
- Detachable Design: Enables rework and replacement of fiber assemblies without compromising alignment or performance.
- Low Insertion Loss: Engineered for precision coupling with minimal signal degradation, supporting both SMF and PMF applications
- Exceptional Repeatability: Metallic optical benches and patented micro-mirror arrays ensure consistent beam shaping and alignment across production batches
Crafted using SENKO’s proprietary stamping process, the MPC leverages metallic aspherical mirrors to fold, focus, and expand light beams with unmatched accuracy. This robust opto-mechanical interface supports high-density ribbon fiber configurations and is compatible with co-packaged optics, pluggable transceivers, and custom sensor modules.
SENKO’s participation in SEMICON Taiwan underscores its commitment to driving innovation in silicon photonics and AI infrastructure. The company continues to collaborate with leading OSATs, foundries, and test and measurement partners to ensure seamless integration and industry-standard compliance.
About SENKO
SENKO Advanced Components, Inc. is a wholly owned subsidiary of SENKO Advance Co., Ltd., headquartered in Yokkaichi, Japan. With 16 locations worldwide and extensive design and manufacturing capabilities, SENKO is recognized as a global leader in passive fiber optic interconnects and optical components. SENKO has deployed over 1 billion connectors, holds 590+ patents, and continues to pioneer next-generation connectivity solutions for the Data Center, Telco, Wireless and Co-Packaged Optics markets.
To accelerate innovation in emerging applications such as Co-Packaged Optics, optical alignment technologies, and AI-enabling interconnects, SENKO has established the Emerging Technologies Group (ETG), a specialized division focused on developing advanced photonic solutions that address the future of high-performance networking.
For more information, visit https://www.senko.com.
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