Photonic-Enabled Heterogeneous Integration: The Future of AI System Scaling

下午 2:05 - 下午 2:35

The exponential growth of artificial intelligence and the slowing of Moore's Law demand a new paradigm for system performance and efficiency. 3D photonic integration of heterogeneous technologies provides a cornerstone for a transformative roadmap that addresses the critical communication bottlenecks that will drive AI innovation.

Lightmatter’s photonic interconnects, using an "edgeless I/O" silicon design, unlocks massive scale-up bandwidth for system-in-package architectures. By facilitating direct, high-density, low-latency optical connections between co-packaged silicon, these AI systems can become significantly more powerful and efficient. Key advancements in silicon photonics, 3D packaging, and high-density laser integration enable this transformation. The fusion of these technologies forges the path toward breakthrough power efficiencies and terabit-per-second-per-millimeter connectivity, building the next generation of AI infrastructure.

Key Technologies Covered

Optics
Silicon Photonics
Lasers
AI Interconnect
Scale-up Networking
3D packaging
Active Interposers
Optical Engines

Featured Speakers

Mr. Sandeep Sane

Sr. Director, Head of Packaging Technologies, Lightmatter

Sandeep Sane is Senior Director and Head of Packaging at Lightmatter, where he leads advanced packaging development for the Passage and LASER product lines. Previously, he was a Principal Engineer at Intel, contributing to silicon-package co-design and co-inventing the widely adopted EMIB packaging technology. He holds over 20 patents and has authored numerous technical publications. Earlier in his career, he worked at IBM Microelectronics. He earned his Ph.D. and M.S. from Caltech and his B.S. from IIT Bombay.