Materials technology and solutions for the communication society after 2020

Thursday, September 19
4:25pm to 4:40pm


In recent years, evaluation of various device applications, such as AI, Cloud, 5G, etc., is accelerating, and mass production is scheduled to start by end of 2020. The materials used for these new device applications are required to have new characteristics that have never been seen before, but there is a concern about the existing performance deterioration by adding these new characteristics. In this situation, Hitachi Chemical has established new Packaging Solution Center (PSC) for material and process evaluation, accelerates material development and provides solutions such as materials and processes in a timely manner to customer requirements. In this presentation, we will introduce about PSC‘s evaluation capability, and material technologies such as thermal management, EMI shielding and low-loss.

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