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Dr. Jun He 何軍

品質暨可靠性組織長
台灣積體電路製造股份有限公司

Education: 

  • Ph.Din Material Science from UC Santa Barbara

Experience:

  • Headof TSMC’s corporate Quality & Reliability
  • Senior Director of TSMC’s Advance Technology Quality & Reliability
  • Senior Director of Intel’s Quality & Reliability for Technology Development and Manufacturing

Biography:

Dr. Jun He currently is the head of TSMC’s corporate Quality & Reliability. He is responsible for end-to-end coverage from incoming materials quality, IP/new technology reliability and qualification as well as manufacturing excellence. Prior to joining TSMC, he served as the senior director at Intel Corporation in charge of overall quality & reliability of Technology Development and Manufacturing including Intel’s fab, assembly and test R&D and worldwide manufacturing operation. 

Dr. He has over 25 years industry experience directly engaged in technology development on Si, assembly and test process. He has 40 technical publications and holds more than 30 U.S. /Foreign patents range from Reliability DR, test patterns for defect screen, Si process innovations and circuit designs. His key contribution to the semiconductor industry includes laser assisted die singulationenabling low-k dielectric; die edge damage monitor; ultra-high density metal fuse technology; advanced passivation process for Redistribution Interconnects and tamper resistant fuse design/architecture for information security. 

Dr. He received his B. S. degree in Physics and Ph.D. in Material Science from the University of California, Santa Barbara.

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