+886.3.560.1777

Chinese


Mr. Mario Ibrahim

Technology & Analyst, Package Assembly Substrate
Yole Developpement

 

Education:

Mario holds an Electronics Engineering Degree from Polytech’ Grenoble (France). He spent 3 apprenticeship years within Imaging Division of STMicroelectronics Grenoble, where he contributed to the test benches park automation within the test & validation team.

Biography:

As a Technology & Market Analyst, Advanced Packaging, Mario Ibrahim is a member of the Semiconductor & Software division at Yole Développement (Yole), part of Yole Group of Companies. Mario is engaged in the development of technology & market reports as well as the production of custom consulting studies. He is also deeply involved in test activities business development within the division.

Prior to Yole, Mario was engaged in test activities development on LEDs at Aledia. He was also in charge of several R&D advanced packaging programs. During his 5 years stay, he developed strong technical & managerial expertise in different semiconductor fields.

Share page with AddThis