Mr. Michael Campbell

Senior Vice President of Engineering




•Qualcomm 1998-to current – 

•SVP engineering at Qualcomm responsible for Product / test engineering for Digital / RF/ PMIC/ RF front end devices and Failure Analysis. 

•Currently driving  test development center for 5G and other product in Hsinchu , drove test development center in Singapore, and design development center in Bangalore. 

•Previous companies Honeywell, Inmosand Mostek

•6 Patents and 5 IDFs in multiple areas of test, process and FA. 



Michael Campbell is Senior Vice President of Engineering for QUALCOMM CDMA Technologies, responsible for QCT Product and Test Engineering, Test Automation and Failure Analysis.  Mike joined QCT in 1996 as a Staff Engineer/Manager and since then Mike has led a diverse set of responsibility at Qualcomm, including, FA, Quality, Design Automation, Yield optimization, Product Engineering, Test Engineering, and Foundry semiconductor analysis.

At Qualcomm, Mike has helped bring up and drive the design office in Bangalore, the Design and test development center in Singapore and a development facility in Taiwan.   In his current role, he is working to improve process, bring up at our foundry partners, and 2nd source optimization.  He is also working to optimize design processes in new process nodes to enable improved time to yield on Qualcomm's products while enable faster time to market, at lower cost.

Prior to joining QUALCOMM, Mike was an engineer and manager at several semiconductor companies, including Mostek, INMOS and Honeywell.   He holds a BSEE & CE from Clarkson University.

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