In this talk, I will first go over the market trends, business size, and technology requirements from the top line of applications and systems. Then I will talk about the opportunities to extend the Moore’s Law scaling with the new dimension enabled by advanced packaging. A few examples will be given. A foundry’s view about current and potential offerings in the advanced packaging technologies will be briefly covered. Finally, I will wrap up with future challenges and how the industry can collaborate to serve the growing market.