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Closing Keynote: A Foundry Perspective: Trends, Opportunities, and Challenges of Advanced Packaging for the 5G/AI Era

Thursday, September 19
4:15pm to 4:50pm

 

Abstract:

In this talk, I will first go over the market trends, business size, and technology requirements from the top line of applications and systems. Then I will talk about the opportunities to extend the Moore’s Law scaling with the new dimension enabled by advanced packaging. A few examples will be given.  A foundry’s view about current and potential offerings in the advanced packaging technologies will be briefly covered. Finally, I will wrap up with future challenges and how the industry can collaborate to serve the growing market.

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