Challenges and Solutions for ALD/CVD Thin Films for 3D Monolithic and Heterogeneous Integration

Thursday, September 19
11:25am to 11:50am


While dimensional shrinkage and equivalent scaling have been the primary drivers of new ALD/CVD deposited films and precursors in the last decades, the advent of 3D Integration is posing a different set of challenges. Among them are the introduction of new elements, the need for very low thermal budget processes to build upon fragile structures, and fast deposition rates owing to the need for relatively thicker films than in classical CMOS and memory devices.  Through some selected examples, we will review how precursor chemistry and dispense technology contributes to enabling 3DI.

Share page with AddThis