- The Hong Kong Polytechnic Master’s Degree – Mechanical, 2002
- The Hong Kong University, MBA, 2015
- Over 15 years Back-end assembly experience
- Participating in package solution and new product development with IDM/OSAT
Mr. Chris Yeung is now the Product Marketing Director for the IC division at ASMPT. His teams are supporting from front to end, including Die Bonding, Wire Bonding, Singulation and Molding. With his front-line exposure and process knowledge, he has been working with customers worldwide on total solutions for new packaging requirements.
He is also current responsible for emerging business in the areas of MEMS & Sensor applications, sharing packaging technology trend and latest packaging solution to our customer.