Mr. Yeung Wai Keung

Product Marketing Director


Education :

  • The Hong Kong Polytechnic  Master’s Degree – Mechanical,  2002
  • The Hong Kong University, MBA,  2015

Experience :

  • Over 15 years Back-end assembly  experience
  • Participating in package solution  and new product development with IDM/OSAT

Biography :

Mr. Chris Yeung is now the Product Marketing Director for the IC division at ASMPT. His teams are supporting from front to end, including Die Bonding,  Wire Bonding, Singulation and Molding. With his front-line exposure  and process knowledge, he has been working with customers worldwide on total solutions for new packaging requirements.

He is also current responsible for emerging business in the areas of MEMS & Sensor applications, sharing packaging technology trend and latest packaging solution to our customer.

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