2019 系統級封測國際高峰論壇 – 第三天

Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park / 中信企業總部A棟三樓雅悅會館馥儷廳 Friday, September 20
8:30am to 5:00pm

Date:Friday, September 20th, 2019
Time:08:30 - 16:40 (08:30-09:00 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park / 中信企業總部A棟三樓雅悅會館馥儷廳
Theme: Hybrid SiP Solutions of Heterogeneous & Homogeneous Integration


With the dynamic development of various applications such as automotive, IoT, 5G and AI high performance computing, the ecosystem and manufacturing technology of semiconductor industry have also encountered major paradigm shift. In addition to scaling, another rising wave led by SiP (System in Package) is expanding the landscape of design, integrating options and advanced manufacturing technologies.  The hybrid SiP solutions of Heterogeneous and Homogeneous integrations combining logic, memory, sensors and other functional chips are groundbreaking and enabling all kinds of new applications.

Through SiP Global Summit Day 3 session, we will reveal the charm of HI double shots (Heterogeneous and Homogeneous Integration) from devices and manufacturing perspectives with speakers from chip, package and system such as NXP, MTK, ASE, Micron, Amkor and Mentor followed by an exciting cross-ecosystem panel discussion to further elaborate and enlighten the way to success with hybrid SiP solutions.


SEMI 會員價
NTD 5,040 NTD 6,300 NTD 5,040 5人以上再享9折

*Tax Included


Sponsored by:



* Forum agenda is subject to change




Dr. Scott Chen 陳光雄
Mr. Akshay Singh
Vice President of Advanced Packaging Technology Development
Micron Technology
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