Date：Tuesday, September 17th, 2019
Time：08:30 - 17:50 (08:30-09:00 for registration)
Venue：Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park / 中信企業總部A棟三樓雅悅會館馥儷廳
Theme: Heterogeneous Integration Packaging Technologies and Smart Manufacturing for 5G & AI Applications
- Mr. Albert Lan, Global Packaging TD, Applied Materials/Vice Chairman, SEMI Taiwan Packaging & Testing Committee
- 5G (with mm-wave transition features) can effectively enable AI life and can be realized by the packaging technologies, such as SiP, Fan Out, 2.5D/3D TSV, and CoW/WoWhybrid bonding.
- To address product applications, and its equipment & material technology solutions in advanced packaging, the forum have invited lots of experts from Fabless design house, IDM, Foundry, OSAT, Equipment and Materials suppliers to share their treasure experiences on future technology development roadmap, challenges, and effective solutions.
- Beside investing in packaging techniques advancement for integrated applications, the driving trend is also to integrate into a full system of high performance and functionality devices with smart manufacturing. The connected system in packaging world shall drive for yield performance excellence in high-tech manufacturing.