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2019 系統級封測國際高峰論壇 – 第一天

馥儷廳雅悅會館/ 中信企業總部A棟三樓 Tuesday, September 17
8:30am to 5:50pm

 

Date:Tuesday, September 17th, 2019
Time:08:30 - 17:50 (08:30-09:00 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park / 中信企業總部A棟三樓雅悅會館馥儷廳
Theme: Heterogeneous Integration Packaging Technologies and Smart Manufacturing for 5G & AI  Applications

Forum Chairs:

  • Mr. Albert Lan, Global Packaging TD, Applied Materials/Vice Chairman, SEMI Taiwan Packaging & Testing Committee

Moderators:

Outline: 

  • 5G (with mm-wave transition features) can effectively enable AI life and can be realized by the packaging technologies, such as SiP, Fan Out, 2.5D/3D TSV, and CoW/WoWhybrid bonding.
  • To address product applications, and its equipment & material technology solutions in advanced packaging, the forum have invited lots of experts from Fabless design house, IDM, Foundry, OSAT, Equipment and Materials suppliers to share their treasure experiences on future technology development roadmap, challenges, and effective solutions.
  • Beside investing in packaging techniques advancement for integrated applications, the driving trend is also to integrate into a full system of high performance and functionality devices with smart manufacturing. The connected system in packaging world shall drive for yield performance excellence in high-tech manufacturing.

 

 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
NTD 5,040 NTD 6,300 NTD 5,040 5人以上再享9折

*Tax Included

 
 
Sponsored by:
                 
                      
              

 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 
 

 

 

對這場活動有興趣嗎?立即報名!

Mr. Richard Salsman
CFO and Vice President of Operations
SEMI
Mr. Santosh Kumar
Director & Principal Analyst
Yole Developpement
Dr. Shin-Puu Jeng 鄭心圃
處長
台灣積體電路股份有限公司
Mr. David Fang 方立志
副總經理
力成科技
Dr. John H. Lau 劉漢誠
CTO
欣興電子
Mr. Markus M. Hoffmann
Head of Business Development Asia-Pacific
Zollner Elektronik AG
Mr. Chris Jones
Director, PVD Product Management
SPTS Technologies Ltd.
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