Ph.D. Materials Engineering, Georgia Institute of Technology
M.S. Materials Science and Engineering, National Tsing Hua University, Taiwan
B.S., Physics, National Tsing Hua University
Senior Director, Advanced Module Technology Div., R&D
Director, Advanced Shrink Technology, TSMC R&D
Submicron Semiconductor Technology R&D, AT&T Bell Labs
Dr. Douglas Yu is TSMC’s Vice President of Integrated Interconnect &Packaging, responsible for research and development of advanced packaging and system integration solutions. Prior to his appointment to Vice President in 2016, Dr. Yu was Senior Director of the Integrated Interconnect & Packaging Division.
Dr. Yu joined TSMC in 1994, serving in a variety of roles throughout his career including backend R&D, and developed technologies critical to the Company’s highly successful transition to copper process at the 0.13 micron generation. Dr. Yu also pioneered TSMC’s wafer-level system integration technologies, including Chip on Wafer on Substrate (CoWoS® ), Integrated Fan-Out (InFO), and System on Integrated Chips (SoICTM), as well as their derivatives.
Dr. Yu became a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2013, and received the Presidential Science Prize of Taiwan in 2017 as well as the IEEE EPS Outstanding Manufacturing Technology Award in 2018. He has received more than 1,800 worldwide patents, including 950+ US patents, while serving at TSMC.