Trend & Challenge of Semiconductor Packaging

Wednesday, September 18
3:15pm to 3:30pm


How would the semiconductor ecosystem evolve in an era where scale and innovation are pushing the boundaries of the industry? What does the future hold for the semiconductor industry in general, and the packaging and test players in particular?

Dr Tien Wu attempts to put things in perspective as he discusses the industry trends and the challenges amidst an uncertain global economic environment. He will also take a deeper look at the forces that will drive innovation and new technology. The next generation of smart computing, 5G, AI and IoT will require heterogeneous integration more than ever, and is where IC packaging and test will increasingly play a leading role.

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