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Introducing Cured Silicone Die Attach Film (DAF)

Thursday, September 19
11:50am to 12:15pm

Abstract:

An optically clear heat-curable silicone hotmelt film for encapsulating display modules will be presented. It provides excellent stress relaxation capability, enabling stress-free large-area encapsulation. This unique encapsulant will provide a novel hotmelt solution for future display module fabrication.

 

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