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Innovations in advanced materials for future nodes

Thursday, September 19
3:50pm to 4:15pm

Abstract:

The development of advanced materials has enabled the implementation of recent technology nodes in the semiconductor industry. Recent materials related advancements that have impacted scaling include spacers for self aligned pitch multiplication schemes as well as deposition precursors for such applications as high-k capacitor dielectrics and replacement metal gates in FinFETs. Next generation devices, including advanced logic devices with gate all around transistors and 3D NAND devices with increasing layer counts both have unique manufacturing challenges that can be solved with the development of new materials and processes. In addition, the development of new materials to meet future scaling requirements relies on a business model that supports collaborative materials and process innovation. This paper will review opportunities for new materials and also discuss the implications to the materials supply chain of the changing industry structure.

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