Date：Friday, September 20th, 2019
With the dynamic development of various applications such as automotive, IoT, 5G and AI high performance computing, the ecosystem and manufacturing technology of semiconductor industry have also encountered major paradigm shift. In addition to scaling, another rising wave led by SiP (System in Package) is expanding the landscape of design, integrating options and advanced manufacturing technologies. The hybrid SiP solutions of Heterogeneous and Homogeneous integrations combining logic, memory, sensors and other functional chips are groundbreaking and enabling all kinds of new applications.
Through SiP Global Summit Day 3 session, we will reveal the charm of HI double shots (Heterogeneous and Homogeneous Integration) from devices and manufacturing perspectives with speakers from chip, package and system such as NXP, MTK, ASE, Micron, Amkor and Mentor followed by an exciting cross-ecosystem panel discussion to further elaborate and enlighten the way to success with hybrid SiP solutions.
|* Forum agenda is subject to change|
If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.
For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance
SiP Global Summit 2019 – Heterogeneous Integration NOW & FUTURE – Day 3
Grand Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park Friday, September 20 8:30am to 4:40pm
Do you want to attend this session? REGISTER NOW!
Ms. E. Jan Vardaman
President and Founder
Dr. Ralf Schmidt
R&D Manager Semiconductor
Atotech Deutschland GmbH
Ms. Kim Arnold
Brewer Science, Inc.
Panel Discussion: Heterogeneous Integration & Homogeneous Integration Double Shot! (HI Double Shot!)