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SiP Global Summit 2019 – Heterogeneous Integration NOW & FUTURE – Day 3

Grand Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park Friday, September 20
8:30am to 4:40pm

Date:Friday, September 20th, 2019
Time:08:30 - 16:40 (08:30-08:55 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park 
Theme: Hybrid SiP Solutions of Heterogeneous & Homogeneous Integration

Forum Chair:

  • Dr. C.P. Hung, Vice President, ASE Group/ Chairman, SEMI Taiwan Packaging &Testing Committee

Moderators:

  • Dr. C.P. Hung, Vice President, ASE Group/ Chairman, SEMI Taiwan Packaging &Testing Committee
  • Dr. Shih-Chieh Chang, Deputy General Director, Industrial Technology Research Institute

Outline: 

With the dynamic development of various applications such as automotive, IoT, 5G and AI high performance computing, the ecosystem and manufacturing technology of semiconductor industry have also encountered major paradigm shift. In addition to scaling, another rising wave led by SiP (System in Package) is expanding the landscape of design, integrating options and advanced manufacturing technologies.  The hybrid SiP solutions of Heterogeneous and Homogeneous integrations combining logic, memory, sensors and other functional chips are groundbreaking and enabling all kinds of new applications.

Through SiP Global Summit Day 3 session, we will reveal the charm of HI double shots (Heterogeneous and Homogeneous Integration) from devices and manufacturing perspectives with speakers from chip, package and system such as NXP, MTK, ASE, Micron, Amkor and Mentor followed by an exciting cross-ecosystem panel discussion to further elaborate and enlighten the way to success with hybrid SiP solutions.

 
Early-bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member
(7/10-9/20)
Group Registration
(7/10-9/20)
NTD 5,040 NTD 6,300 NTD 5,040 Extra 10% discount
(More than 5 people)

*Tax Included

 
 
Sponsored by:

 

 

 

   

 

 

 
 
* Forum agenda is subject to change

 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

Do you want to attend this session? REGISTER NOW!

Mr. Richard Salsman
CFO and Vice President of Operations
SEMI
Dr. Shih-Chieh
Deputy General Director
Electronic & Optoelectronics System Reseach Laboratories, ITRI
Dr. Akshay Singh
Vice President of Advanced Packaging Technology Development
Micron Technology
Dr. Jerome Chu
Senior Director
NXP Semiconductors
Mr. Scott Chen
Senior Vice President
ASE Group
Mr. Steven Chiu
Deputy Director
MediaTek Inc.
Dr. Akshay Singh
Vice President of Advanced Packaging Technology Development
Micron Technology
Mr. YoungSuk Chung
Senior Director
Amkor Technology Inc.
Mr. Lincoln Lee
Technical Director, PacRim
Mentor, A Siemens Business
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