SiP Global Summit 2019 – Heterogeneous Integration NOW & FUTURE – Day 3

Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park Friday, September 20
8:30am to 5:00pm

Date:Friday, September 20th, 2019
Time:08:30 - 16:40 (08:30-09:00 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park 
Theme: Hybrid: Heterogeneous & Homogeneous
Outline: (TBD)


Early-bird Original
NTD 5,040 NTD 6,300

*Tax Included

Sponsored by:






* Forum agenda is subject to change


If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance


Do you want to attend this session? REGISTER NOW!

Mr. Akshay Singh
Vice President of Advanced Packaging Technology Development
Micron Technology
Mr. Ron Huemoeller
Corporate Vice President, Head of Global R&D
Amkor Technology Inc.
Mr. Lincoln Lee
Technical Director, PacRim
Mentor, A Siemens Business
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